Rapidus and IBM have announced a partnership focused on developing mass production technologies for chiplet packages. As part of the agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, with a goal of collaborating to further innovate in this space. This partnership is a result of an international collaboration within the framework of the “Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors” project conducted by Japan’s NEDO.
The collaboration with IBM builds on an existing agreement for the joint development of 2nm node technology. Engineers from both companies will work together at IBM’s facilities in North America to research and develop semiconductor packaging for high-performance computer systems. IBM has a strong background in R&D and manufacturing technologies for semiconductor packaging, as well as experience in partnering with Japanese semiconductor manufacturers and equipment/material suppliers.
Rapidus plans to utilize IBM’s expertise to establish chiplet packaging technology, contributing to advancements in the semiconductor industry. This partnership signifies a strategic collaboration aimed at driving innovation and enhancing semiconductor manufacturing capabilities for high-performance computer systems.
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