MediaTek has introduced the new Dimensity 8300 processor for smartphones, which is designed to combine AI capabilities, improved performance, energy efficiency, and adaptive gaming technology. The company aims to bring innovation to the field of generative AI and open up new possibilities for smartphone users.
The Dimensity 8300 is part of the Dimensity 8000 family and is designed to offer flagship experiences to the premium 5G smartphone segment. This chip provides generative AI capabilities, advanced mobile gaming technology, and fast connectivity while ensuring low power consumption.
The Dimensity 8300 is a system on a chip (SoC) based on a 4 nanometer second generation process manufactured by TSMC. It features an eight-core CPU, with four Arm Cortex-A715 cores and four Cortex-A510 cores built on Arm’s v9 CPU architecture. The CPU offers a 20 percent increase in performance and a 30 percent improvement in energy efficiency compared to the previous generation. The GPU Mali-G615 MC6 provides up to 60 percent more performance and a 55 percent increase in energy efficiency.
The chip also includes full support for generative AI capabilities and comes with an APU 780 AI processor, which delivers a 3.3x increase in AI performance compared to the Dimensity 8200. This allows for innovative applications that use large language models and stable diffusion.
Furthermore, the Dimensity 8300’s AI capabilities enhance photography and video capture with the HDR-ISP Imagiq 980 technology. It also optimizes battery life and supports MediaTek HyperEngine adaptive gaming technology to improve gaming performance and battery life. The chip offers ultra-fast connectivity with a 3GPP version 16 5G modem and enhanced WiFi 6E performance.
MediaTek has announced that the Dimensity 8300 will power 5G devices launching globally before the end of 2023. This new processor represents a significant advancement in smartphone technology, offering users advanced AI capabilities, improved performance, and energy efficiency.