TSMC Introduces A16 Technology, Aims for Mass Production by 2026

TSMC revealed its A16 (1.6nm) technology at the 2024 North America Technology Symposium in California, introducing plans to mass-produce the new manufacturing process in 2026. The Taiwan-based chip foundry highlighted that the A16 technology would enhance logic density and chip performance by incorporating advanced nanosheet transistors with backside power rail solutions. Compared to the N2P process, A16 offers an 8-10% increase in speed at the same operating voltage, a 15-20% reduction in power consumption at the same speed, and a density improvement of up to 1.1 times to cater to data center products, as noted by TSMC.

The A16 technology was presented by TSMC at the 2024 North America Technology Symposium held in California, showcasing their plans to commence mass production with the new manufacturing process by 2026. TSMC stated that the A16 technology would elevate logic density and chip performance by integrating advanced nanosheet transistors with backside power rail solutions. In comparison to the N2P process, A16 offers significant improvements including an 8-10% increase in speed at the same operating voltage, a 15-20% reduction in power consumption at the same speed, and a density enhancement of up to 1.1 times to cater to data center products.

During the 2024 North America Technology Symposium in California, TSMC introduced its A16 (1.6nm) technology and announced plans to start mass-producing with the new manufacturing process in 2026. TSMC emphasized that the A16 technology would enhance logic density and chip performance by merging advanced nanosheet transistors with backside power rail solutions. When compared to the N2P process, A16 offers significant benefits such as an 8-10% increase in speed at the same operating voltage, a 15-20% reduction in power consumption at the same speed, and a density improvement of up to 1.1 times to cater to data center products.