Utilizing PC’s heatsink technology to address overheating in Exynos chipset could benefit Samsung

Samsung is considering different processor options for its upcoming Galaxy S25 series flagship. Earlier reports suggested that the series might use the Exynos 2500 processor in certain regions, potentially even outperforming the Snapdragon 8 Gen 4 processor. However, a new report from TheElec indicates that Samsung is exploring a new heatsink technology to address overheating issues in future Exynos chipsets. While the current Exynos 2400 processor is powerful, it has faced challenges with throttling and higher temperatures compared to Qualcomm Snapdragon chips.

The new chip-packaging technology being developed by Samsung is known as fan-out wafer-level package-HPB (FOWLP-HPB). By implementing a heat path block (HPB) heatsink on top of the processor, this technology aims to enhance heat dissipation. Initially used in PCs and servers, this technology is now being adapted for smartphones due to their compact size. Samsung’s Advanced Package (AVP) business within its chip division is leading the development effort and is projected to finalize the technology by Q4 2024, with mass production to follow.

The potential integration of this new heatsink technology in upcoming Exynos processors aligns with speculation that the Exynos 2500 chipset might power the Galaxy S25 series. However, there have been conflicting reports about Samsung’s processor choices, with some suggesting a switch to MediaTek due to yield issues. Industry analysts have also hinted that Qualcomm could become the exclusive chip supplier for the Galaxy S25 lineup, further complicating the predictions.

Furthermore, there are talks of Samsung streamlining its Galaxy S series lineup by discontinuing the Plus models and possibly incorporating three different chips in varying combinations. As the company navigates through these speculations and technological developments, consumers and tech enthusiasts eagerly await official announcements regarding Samsung’s future flagship devices.